Method for adjusting a target feature in a model of a patterning process based on local electric fields

ABSTRACT

A method for determining a target feature in a model of a patterning process based on local electric fields estimated for the patterning process. The method includes obtaining a mask stack region of interest. The mask stack region of interest has one or more characteristics associated with propagation of electromagnetic waves through the mask stack region of interest. The mask stack region of interest includes the target feature. The method includes estimating a local electric field based on the one or more characteristics associated with the propagation of electromagnetic waves through the mask stack region of interest. The local electric field is estimated for a portion of the mask stack region of interest in proximity to the target feature. The method includes determining the target feature based on the estimated local electric field.

This application is a continuation of U.S. patent application Ser. No.17/298,640, filed on May 31, 2021, which is the U.S. national phaseentry of PCT Patent Application No. PCT/EP2019/080996, filed on Nov. 12,2019, which claims the benefit of priority of European PatentApplication No. 18211056.9, filed on Dec. 7, 2018, each of the foregoingapplications is incorporated herein in its entirety by reference.

TECHNICAL FIELD

The description herein relates generally to mask manufacturing andpatterning processes. More particularly, the description relates to anapparatus and a method for adjusting a target feature in a model of apatterning process based on local electric fields estimated for thepatterning process.

BACKGROUND

A lithographic projection apparatus can be used, for example, in themanufacture of integrated circuits (ICs). In such a case, a patterningdevice (e.g., a mask) may contain or provide a pattern corresponding toan individual layer of the IC (“design layout”), and this pattern can betransferred onto a target portion (e.g. comprising one or more dies) ona substrate (e.g., silicon wafer) that has been coated with a layer ofradiation-sensitive material (“resist”), by methods such as irradiatingthe target portion through the pattern on the patterning device. Ingeneral, a single substrate contains a plurality of adjacent targetportions to which the pattern is transferred successively by thelithographic projection apparatus, one target portion at a time. In onetype of lithographic projection apparatuses, the pattern on the entirepatterning device is transferred onto one target portion in one go; suchan apparatus is commonly referred to as a stepper. In an alternativeapparatus, commonly referred to as a step-and-scan apparatus, aprojection beam scans over the patterning device in a given referencedirection (the “scanning” direction) while synchronously moving thesubstrate parallel or anti-parallel to this reference direction.Different portions of the pattern on the patterning device aretransferred to one target portion progressively. Since, in general, thelithographic projection apparatus will have a reduction ratio M (e.g.,4), the speed F at which the substrate is moved will be 1/M times thatat which the projection beam scans the patterning device. Moreinformation with regard to lithographic devices as described herein canbe gleaned, for example, from U.S. Pat. No. 6,046,792, incorporatedherein by reference.

Prior to transferring the pattern from the patterning device to thesubstrate, the substrate may undergo various procedures, such aspriming, resist coating, and a soft bake. After exposure, the substratemay be subjected to other procedures (“post-exposure procedures”), suchas a post-exposure bake (PEB), development, a hard bake andmeasurement/inspection of the transferred pattern. This array ofprocedures is used as a basis to make an individual layer of a device,e.g., an IC. The substrate may then undergo various processes such asetching, ion-implantation (doping), metallization, oxidation,chemo-mechanical polishing, etc., all intended to finish off theindividual layer of the device. If several layers are required in thedevice, then the whole procedure, or a variant thereof, is repeated foreach layer. Eventually, a device will be present in each target portionon the substrate. These devices are then separated from one another by atechnique such as dicing or sawing, whence the individual devices can bemounted on a carrier, connected to pins, etc.

Thus, manufacturing devices, such as semiconductor devices, typicallyinvolves processing a substrate (e.g., a semiconductor wafer) using anumber of fabrication processes to form various features and multiplelayers of the devices. Such layers and features are typicallymanufactured and processed using, e.g., deposition, lithography, etch,chemical-mechanical polishing, and ion implantation. Multiple devicesmay be fabricated on a plurality of dies on a substrate and thenseparated into individual devices. This device manufacturing process maybe considered a patterning process. A patterning process involves apatterning step, such as optical and/or nanoimprint lithography using apatterning device in a lithographic apparatus, to transfer a pattern onthe patterning device to a substrate and typically, but optionally,involves one or more related pattern processing steps, such as resistdevelopment by a development apparatus, baking of the substrate using abake tool, etching using the pattern using an etch apparatus, etc.

As noted, lithography is a central step in the manufacturing of devicesuch as ICs, where patterns formed on substrates define functionalelements of the devices, such as microprocessors, memory chips, etc.Similar lithographic techniques are also used in the formation of flatpanel displays, micro-electro mechanical systems (MEMS) and otherdevices.

As semiconductor manufacturing processes continue to advance, thedimensions of functional elements have continually been reduced whilethe amount of functional elements, such as transistors, per device hasbeen steadily increasing over decades, following a trend commonlyreferred to as “Moore's law”. At the current state of technology, layersof devices are manufactured using lithographic projection apparatusesthat project a design layout onto a substrate using illumination from adeep-ultraviolet illumination source, creating individual functionalelements having dimensions well below 100 nm, i.e. less than half thewavelength of the radiation from the illumination source (e.g., a 193 nmillumination source).

This process in which features with dimensions smaller than theclassical resolution limit of a lithographic projection apparatus areprinted, is commonly known as low-k₁ lithography, according to theresolution formula CD=k₁×λ/NA, where λ is the wavelength of radiationemployed (currently in most cases 248 nm or 193 nm), NA is the numericalaperture of projection optics in the lithographic projection apparatus,CD is the “critical dimension”—generally the smallest feature sizeprinted—and k₁ is an empirical resolution factor. In general, thesmaller k₁ the more difficult it becomes to reproduce a pattern on thesubstrate that resembles the shape and dimensions planned by a designerin order to achieve particular electrical functionality and performance.To overcome these difficulties, sophisticated fine-tuning steps areapplied to the lithographic projection apparatus, the design layout, orthe patterning device. These include, for example, but not limited to,optimization of NA and optical coherence settings, customizedillumination schemes, use of phase shifting patterning devices, opticalproximity correction (OPC, sometimes also referred to as “optical andprocess correction”) in the design layout, or other methods generallydefined as “resolution enhancement techniques” (RET). The term“projection optics” as used herein should be broadly interpreted asencompassing various types of optical systems, including refractiveoptics, reflective optics, apertures and catadioptric optics, forexample. The term “projection optics” may also include componentsoperating according to any of these design types for directing, shapingor controlling the projection beam of radiation, collectively orsingularly. The term “projection optics” may include any opticalcomponent in the lithographic projection apparatus, no matter where theoptical component is located on an optical path of the lithographicprojection apparatus. Projection optics may include optical componentsfor shaping, adjusting and/or projecting radiation from the sourcebefore the radiation passes the patterning device, and/or opticalcomponents for shaping, adjusting and/or projecting the radiation afterthe radiation passes the patterning device. The projection opticsgenerally exclude the source and the patterning device.

SUMMARY

According to an embodiment, a method for adjusting a target feature in amodel of a patterning process based on local electric fields estimatedfor the patterning process is provided. The method comprises obtaining,with a hardware computer system, a mask stack region of interest. Themask stack region of interest has one or more characteristics associatedwith propagation of electromagnetic waves through the mask stack regionof interest. The mask stack region of interest includes the targetfeature. The method comprises estimating, with the hardware computersystem, a local electric field based on the one or more characteristicsassociated with the propagation of electromagnetic waves through themask stack region of interest. The local electric field is estimated fora portion of the mask stack region of interest in proximity to thetarget feature. The method comprises adjusting, by the hardware computersystem, the target feature based on the estimated local electric field.

In an embodiment, adjusting the target feature based on the estimatedlocal electric field comprises determining, by the hardware computersystem, an effect of the estimated local electric field on the targetfeature during an etch of the patterning process, or an effect of theestimated local electric field and the target feature on the etch, andadjusting, by the hardware computer system, the target feature based onthe estimated effect on the target feature during the etch.

In an embodiment, determining the effect of the estimated local electricfield on the target feature comprises determining, by the hardwarecomputer system, an image charge on conducting components in the portionof the mask stack region of interest in proximity to the target featureand/or solving, by the hardware computer system, Poisson's Equation todetermine the local electric field.

In an embodiment, the target feature is a metrology target design. In anembodiment, the method comprises iteratively repeating, by the hardwarecomputer system, the estimating of the local electric field and theadjusting of the target feature one or more times to enhance themetrology target design. In an embodiment, the method further comprisesenhancing, with the hardware computer system, the metrology targetdesign to reduce an estimated difference between an overlay measuredafter photo resist development (after development inspection—ADI) and anoverlay measured after an etch (after etch inspection—AEI) of thepatterning process. In an embodiment, the difference between ADI and AEIis an overlay penalty (ADI−AEI). In an embodiment, the method furthercomprises determining, with the hardware computer system, a correctionfor an AEI overlay measurement, and/or determining the AEI overlaymeasurement, based on the enhanced metrology target design.

In an embodiment, the adjusting of the target feature one or more timesto enhance the metrology target design comprises one or more ofadjusting, by the hardware computer system, placement of metrologytarget features relative to each other, placement of the metrologytarget relative to other features in a mask layout design, or adding, bythe hardware computer system, one or more dummy features to themetrology target design.

In an embodiment, the one or more characteristics associated withpropagation of electromagnetic waves through the mask stack region ofinterest comprise stack characteristics including one or more of layerproperties, stack design rules, or layer integration requirements.

In an embodiment, the one or more characteristics associated withpropagation of electromagnetic waves through the mask stack region ofinterest comprise metrology target design characteristics including oneor more of a top grating design, contrast, or a bottom grating design.

In an embodiment, the target feature is a mask layout design. In anembodiment, the method further comprises iteratively repeating, by thehardware computer system, the estimating of the local electric field andthe adjusting of the target feature one or more times to enhance themask layout design.

In an embodiment, the adjusting of the target feature one or more timesto enhance the mask layout design comprises one or more of adjusting, bythe hardware computer system, feature placement in the mask layoutdesign, or adding, by the hardware computer system, one or more dummyfeatures to the mask layout design.

In an embodiment, the adjusting of the target feature one or more timesto enhance the mask layout design comprises (1) determining, by thehardware computer system, an edge placement, (2) determining, by thehardware computer system, the effect of the estimated local electricfield on the mask layout design during the etch of the patterningprocess based on the edge placement, and (3) adjusting, by the hardwarecomputer system, the mask layout design based on the effect estimatedbased on the edge placement.

In an embodiment, the one or more characteristics associated withpropagation of electromagnetic waves through the mask stack region ofinterest comprise mask layout design characteristics including anarrangement of features relative to each other, proximity of conductingportions of individual layers to each other, or a location of the maskstack region of interest relative to an edge and/or a center of a waferin the model of the patterning process.

In an embodiment, the method further comprises outputting, by thehardware computer system, and indication of the estimated local electricfield and/or the effect of the estimated local electric field on thetarget feature for review by a user; receiving entries and/orselections, by the hardware computer system, from the user that indicateadjustments to the target feature desired by the user; and adjusting, bythe hardware computer system, the target feature based on the estimatedlocal electric field and the desired adjustments.

In an embodiment, the method further comprises adjusting, by thehardware computer system, the target feature based on the estimatedlocal electric field to facilitate three-dimensional metrology.

According to another embodiment, a computer program product is provided.The computer program product comprises a non-transitory computerreadable medium having instructions recorded thereon, the instructionswhen executed by a computer implementing the method described above.

BRIEF DESCRIPTION OF THE DRAWINGS

The above aspects and other aspects and features will become apparent tothose ordinarily skilled in the art upon review of the followingdescription of specific embodiments in conjunction with the accompanyingfigures, wherein:

FIG. 1 schematically depicts a lithography apparatus, according to anembodiment.

FIG. 2 schematically depicts an embodiment of a lithographic cell orcluster, according to an embodiment.

FIG. 3 schematically depicts an example inspection apparatus andmetrology technique, according to an embodiment.

FIG. 4 schematically depicts an example inspection apparatus, accordingto an embodiment.

FIG. 5 illustrates the relationship between an illumination spot of aninspection apparatus and a metrology target, according to an embodiment.

FIG. 6 schematically depicts a process of deriving a plurality ofvariables of interest based on measurement data, according to anembodiment;

FIG. 7A is a flow chart showing various stages of a ‘design for control’process flow, according to an embodiment.

FIG. 7B is a block diagram showing various stages for visualization,according to an embodiment.

FIG. 7C is a flow chart showing how the ‘design for control’ processdetermines metrology target designs robust against processperturbations, according to an embodiment.

FIG. 8A illustrates a global electric field associated with a wafer anda focus ring, according to an embodiment.

FIG. 8B illustrates modeled device structures on a wafer and the effectlocal electric fields impacted by a buried conducting wafer layer haveon metrology targets or any other feature to be etched, according to anembodiment.

FIG. 9A illustrates two modeled cross sections of layers of a portion ofa wafer stack, according to an embodiment.

FIG. 9B illustrates two modeled cross sections of layers of anotherportion of the wafer stack, according to an embodiment.

FIG. 9C illustrates two modeled cross sections of layers of anotherportion of the wafer stack, according to an embodiment.

FIG. 9D illustrates another modeled cross section of layers of anotherportion of the wafer stack, according to an embodiment.

FIG. 9E illustrates two modeled cross sections of layers of a portion ofa metrology target that have been enhanced using the present systemsand/or methods by adding substructures and/or dummy features to thegrating design based on the local electric field associated with thatportion of the metrology target, according to an embodiment.

FIG. 10 illustrates a method for adjusting a target feature (e.g., ametrology target design) in a model of a patterning process based onlocal electric fields estimated for the patterning process, according toan embodiment.

FIG. 11 illustrates another method for adjusting a target feature (e.g.,a mask layout design) in a model of a patterning process based on localelectric fields estimated for the patterning process, according to anembodiment.

FIG. 12 is a block diagram of an example computer system, according toan embodiment.

FIG. 13 is a schematic diagram of a lithographic projection apparatussimilar to FIG. 1 , according to an embodiment.

FIG. 14 is a more detailed view of the apparatus in FIG. 13 , accordingto an embodiment.

FIG. 15 is a more detailed view of the source collector module SO of theapparatus of FIG. 13 and FIG. 14 , according to an embodiment.

DETAILED DESCRIPTION

The description herein relates generally to mask manufacturing andpatterning processes. More particularly, the description relates toapparatuses or methods for adjusting a target feature in a model of apatterning process based on local electric fields estimated for thepatterning process. This may facilitate determining an etch profile of alayer (or a portion of a layer, e.g., at or near a metrology target) ofa wafer for simulation systems and/or have other purposes. Thesesimulation systems may use the determined etch profile during alignmentmetrology target design, or design of other product features, asnon-limiting examples, or in other operations.

As described in more detail below, overlay is an indication of arelative shift between a current layer of a wafer and the previouslayer. Overlay is often determined based on the optical response ofmetrology marks included in scribe lines. The metrology marks and theoptical response are typically modeled using software tools such as ASMLDesign 4 Control (D4C) and YieldStar to facilitate optimization of thewafer manufacturing recipe and metrology mark design (e.g., to reduceoverlay and/or for other purposes) before a wafer is physicallymanufactured.

A model is used in typically used in overlay and metrology mark designfor patterning process definition (e.g., to model or otherwise determineetch profiles). For example, D4C or other similar tools need an etchprofile (among many other process related inputs) to construct a “stack”that models an actual wafer for accurate simulation. However, a typicalmodel is overly simplistic (e.g., the model uses a global electric fieldfor an etch tool.). Etch effects on a wafer may not be well described bythe model, which decreases simulation accuracy, and may result in poorcorrelation between simulated overlay measurements and actual overlaymeasurements. YieldStar (for example) or other scanner metrology marksignals are sensitive to modeled post-etch profiles. Etch profiledifferences between modeled and actual profiles are often caused by amodel's inability to accurately account for local electric fields.

For example, it is generally known that the global electric fielddistribution inside an etch tool has a significant effect on how thestructures defined in photo resist will be transferred into theunderlying substrate. This effect can be characterized by consideringthe difference between the overlay measured after photo resistdevelopment (after development inspection, or ADI) and the overlay thatis measured after etch (after etch inspection, or AEI). Etch tools areequipped with a focus ring. The focus ring (a consumable) is etchedalong with a wafer and this influences the electric field homogeneityclose to the wafer edge. This, in turn, influences an etch inducedoverlay penalty (ADI-AEI). The electric field inhomogeneity due to thefocus ring wear can be corrected by actuating the focus ring. Thepresent systems and methods consider the effect of the local electricfields and their impact on overlay registration and device featuresafter etch.

The present systems and methods are described herein in the context ofmetrology mark and other wafer feature generation, but this is notintended to be limiting. The present systems and methods may begenerally applied to a number of different processes where estimatingthe effect of local electric fields is useful. The present systems andmethods facilitate enhanced (relative to prior art systems) and/orotherwise more accurate modeling and/or determination of an etchprofile, for example. This more accurate modeling and/or determinationof an etch profile may enhance determination of the relative shiftbetween a current layer of a wafer and the previous layer—overlay,facilitate a decrease in the relative shift between the current layer ofa wafer and the previous layer, facilitate enhanced wafer feature designand/or enhanced wafer feature placement, and/or have other purposes. Asdescribed herein, overlay is often determined based on the opticalresponse of metrology marks included in scribe lines. In someembodiments, the present systems and methods generate a more accurate(relative to prior art systems) metrology target model, which in turn,facilitates more accurate (relative to prior art systems) determinationof overlay or other parameters.

The following paragraphs describe several components of a system and/orrelated systems, as well as methods, for adjusting a target feature in amodel of a patterning process based on local electric fields estimatedfor the patterning process. As described above these simulation systemsmay use estimated local electric fields during alignment metrologytarget design, or wafer feature design, for example, or during otheroperations.

Although specific reference may be made in this text to the manufactureof integrated circuits (ICs), it should be understood that thedescription herein has many other possible applications. For example, itmay be employed in the manufacture of integrated optical systems,guidance and detection patterns for magnetic domain memories,liquid-crystal display panels, thin-film magnetic heads, etc. Theskilled artisan will appreciate that, in the context of such alternativeapplications, any use of the terms “reticle”, “wafer” or “die” in thistext should be considered as interchangeable with the more general terms“mask”, “substrate” and “target portion”, respectively.

FIG. 1 schematically depicts an embodiment of a lithographic apparatusLA. The apparatus comprises:

-   -   an illumination system (illuminator) IL configured to condition        a radiation beam B (e.g. UV radiation, DUV radiation, or EUV        radiation);    -   a support structure (e.g. a mask table) MT constructed to        support a patterning device (e.g. a mask) MA and connected to a        first positioner PM configured to accurately position the        patterning device in accordance with certain parameters;    -   a substrate table (e.g. a wafer table) WT (e.g., WTa, WTb or        both) configured to hold a substrate (e.g. a resist-coated        wafer) W and coupled to a second positioner PW configured to        accurately position the substrate in accordance with certain        parameters; and    -   a projection system (e.g. a refractive projection lens system)        PS configured to project a pattern imparted to the radiation        beam B by patterning device MA onto a target portion C (e.g.        comprising one or more dies and often referred to as fields) of        the substrate W. The projection system is supported on a        reference frame (RF).

As here depicted, the apparatus is of a transmissive type (e.g.employing a transmissive mask). Alternatively, the apparatus may be of areflective type (e.g. employing a programmable mirror array of a type asreferred to above, or employing a reflective mask).

The illuminator IL receives a beam of radiation from a radiation sourceSO. The source and the lithographic apparatus may be separate entities,for example when the source is an excimer laser. In such cases, thesource is not considered to form part of the lithographic apparatus andthe radiation beam is passed from the source SO to the illuminator ILwith the aid of a beam delivery system BD comprising for examplesuitable directing mirrors and/or a beam expander. In other cases thesource may be an integral part of the apparatus, for example when thesource is a mercury lamp. The source SO and the illuminator IL, togetherwith the beam delivery system BD if required, may be referred to as aradiation system.

The illuminator IL may alter the intensity distribution of the beam. Theilluminator may be arranged to limit the radial extent of the radiationbeam such that the intensity distribution is non-zero within an annularregion in a pupil plane of the illuminator IL. Additionally oralternatively, the illuminator IL may be operable to limit thedistribution of the beam in the pupil plane such that the intensitydistribution is non-zero in a plurality of equally spaced sectors in thepupil plane. The intensity distribution of the radiation beam in a pupilplane of the illuminator IL may be referred to as an illumination mode.

The illuminator IL may comprise adjuster AM configured to adjust the(angular/spatial) intensity distribution of the beam. Generally, atleast the outer and/or inner radial extent (commonly referred to asσ-outer and σ-inner, respectively) of the intensity distribution in apupil plane of the illuminator can be adjusted. The illuminator IL maybe operable to vary the angular distribution of the beam. For example,the illuminator may be operable to alter the number, and angular extent,of sectors in the pupil plane wherein the intensity distribution isnon-zero. By adjusting the intensity distribution of the beam in thepupil plane of the illuminator, different illumination modes may beachieved. For example, by limiting the radial and angular extent of theintensity distribution in the pupil plane of the illuminator IL, theintensity distribution may have a multi-pole distribution such as, forexample, a dipole, quadrupole or hexapole distribution. A desiredillumination mode may be obtained, e.g., by inserting an optic whichprovides that illumination mode into the illuminator IL or using aspatial light modulator.

The illuminator IL may be operable to alter the polarization of the beamand may be operable to adjust the polarization using adjuster AM. Thepolarization state of the radiation beam across a pupil plane of theilluminator IL may be referred to as a polarization mode. The use ofdifferent polarization modes may allow greater contrast to be achievedin the image formed on the substrate W. The radiation beam may beunpolarized. Alternatively, the illuminator may be arranged to linearlypolarize the radiation beam. The polarization direction of the radiationbeam may vary across a pupil plane of the illuminator IL. Thepolarization direction of radiation may be different in differentregions in the pupil plane of the illuminator IL. The polarization stateof the radiation may be chosen in dependence on the illumination mode.For multi-pole illumination modes, the polarization of each pole of theradiation beam may be generally perpendicular to the position vector ofthat pole in the pupil plane of the illuminator IL. For example, for adipole illumination mode, the radiation may be linearly polarized in adirection that is substantially perpendicular to a line that bisects thetwo opposing sectors of the dipole. The radiation beam may be polarizedin one of two different orthogonal directions, which may be referred toas X-polarized and Y-polarized states. For a quadrupole illuminationmode the radiation in the sector of each pole may be linearly polarizedin a direction that is substantially perpendicular to a line thatbisects that sector. This polarization mode may be referred to as XYpolarization. Similarly, for a hexapole illumination mode the radiationin the sector of each pole may be linearly polarized in a direction thatis substantially perpendicular to a line that bisects that sector. Thispolarization mode may be referred to as TE polarization.

In addition, the illuminator IL generally comprises various othercomponents, such as an integrator IN and a condenser CO. Theillumination system may include various types of optical components,such as refractive, reflective, magnetic, electromagnetic, electrostaticor other types of optical components, or any combination thereof, fordirecting, shaping, or controlling radiation.

Thus, the illuminator provides a conditioned beam of radiation B, havinga desired uniformity and intensity distribution in its cross section.

The support structure MT supports the patterning device in a manner thatdepends on the orientation of the patterning device, the design of thelithographic apparatus, and other conditions, such as for examplewhether or not the patterning device is held in a vacuum environment.The support structure may use mechanical, vacuum, electrostatic or otherclamping techniques to hold the patterning device. The support structuremay be a frame or a table, for example, which may be fixed or movable asrequired. The support structure may ensure that the patterning device isat a desired position, for example with respect to the projectionsystem. Any use of the terms “reticle” or “mask” herein may beconsidered synonymous with the more general term “patterning device.”

The term “patterning device” used herein should be broadly interpretedas referring to any device that can be used to impart a pattern in atarget portion of the substrate. In an embodiment, a patterning deviceis any device that can be used to impart a radiation beam with a patternin its cross-section to create a pattern in a target portion of thesubstrate. It should be noted that the pattern imparted to the radiationbeam may not exactly correspond to the desired pattern in the targetportion of the substrate, for example if the pattern includesphase-shifting features or so called assist features. Generally, thepattern imparted to the radiation beam will correspond to a particularfunctional layer in a device being created in a target portion of thedevice, such as an integrated circuit.

A patterning device may be transmissive or reflective. Examples ofpatterning devices include masks, programmable mirror arrays, andprogrammable LCD panels. Masks are well known in lithography, andinclude mask types such as binary, alternating phase-shift, andattenuated phase-shift, as well as various hybrid mask types. An exampleof a programmable mirror array employs a matrix arrangement of smallmirrors, each of which can be individually tilted to reflect an incomingradiation beam in different directions. The tilted mirrors impart apattern in a radiation beam, which is reflected by the mirror matrix.

The term “projection system” used herein should be broadly interpretedas encompassing any type of projection system, including refractive,reflective, catadioptric, magnetic, electromagnetic and electrostaticoptical systems, or any combination thereof, as appropriate for theexposure radiation being used, or for other factors such as the use ofan immersion liquid or the use of a vacuum. Any use of the term“projection lens” herein may be considered as synonymous with the moregeneral term “projection system”.

The projection system PS has an optical transfer function which may benon-uniform, which can affect the pattern imaged on the substrate W. Forunpolarized radiation such effects can be fairly well described by twoscalar maps, which describe the transmission (apodization) and relativephase (aberration) of radiation exiting the projection system PS as afunction of position in a pupil plane thereof. These scalar maps, whichmay be referred to as the transmission map and the relative phase map,may be expressed as a linear combination of a complete set of basisfunctions. A particularly convenient set is the Zernike polynomials,which form a set of orthogonal polynomials defined on a unit circle. Adetermination of each scalar map may involve determining thecoefficients in such an expansion. Since the Zernike polynomials areorthogonal on the unit circle, the Zernike coefficients may bedetermined by calculating the inner product of a measured scalar mapwith each Zernike polynomial in turn and dividing this by the square ofthe norm of that Zernike polynomial.

The transmission map and the relative phase map are field and systemdependent. That is, in general, each projection system PS will have adifferent Zernike expansion for each field point (i.e. for each spatiallocation in its image plane). The relative phase of the projectionsystem PS in its pupil plane may be determined by projecting radiation,for example from a point-like source in an object plane of theprojection system PS (i.e. the plane of the patterning device MA),through the projection system PS and using a shearing interferometer tomeasure a wavefront (i.e. a locus of points with the same phase). Ashearing interferometer is a common path interferometer and therefore,advantageously, no secondary reference beam is required to measure thewavefront. The shearing interferometer may comprise a diffractiongrating, for example a two dimensional grid, in an image plane of theprojection system (i.e. the substrate table WT) and a detector arrangedto detect an interference pattern in a plane that is conjugate to apupil plane of the projection system PS. The interference pattern isrelated to the derivative of the phase of the radiation with respect toa coordinate in the pupil plane in the shearing direction. The detectormay comprise an array of sensing elements such as, for example, chargecoupled devices (CCDs).

The projection system PS of a lithography apparatus may not producevisible fringes and therefore the accuracy of the determination of thewavefront can be enhanced using phase stepping techniques such as, forexample, moving the diffraction grating. Stepping may be performed inthe plane of the diffraction grating and in a direction perpendicular tothe scanning direction of the measurement. The stepping range may be onegrating period, and at least three (uniformly distributed) phase stepsmay be used. Thus, for example, three scanning measurements may beperformed in the y-direction, each scanning measurement being performedfor a different position in the x-direction. This stepping of thediffraction grating effectively transforms phase variations intointensity variations, allowing phase information to be determined. Thegrating may be stepped in a direction perpendicular to the diffractiongrating (z direction) to calibrate the detector.

The diffraction grating may be sequentially scanned in two perpendiculardirections, which may coincide with axes of a co-ordinate system of theprojection system PS (x and y) or may be at an angle such as 45 degreesto these axes. Scanning may be performed over an integer number ofgrating periods, for example one grating period. The scanning averagesout phase variation in one direction, allowing phase variation in theother direction to be reconstructed. This allows the wavefront to bedetermined as a function of both directions.

The transmission (apodization) of the projection system PS in its pupilplane may be determined by projecting radiation, for example from apoint-like source in an object plane of the projection system PS (i.e.the plane of the patterning device MA), through the projection system PSand measuring the intensity of radiation in a plane that is conjugate toa pupil plane of the projection system PS, using a detector. The samedetector as is used to measure the wavefront to determine aberrationsmay be used.

The projection system PS may comprise a plurality of optical (e.g.,lens) elements and may further comprise an adjustment mechanism AMconfigured to adjust one or more of the optical elements to correct foraberrations (phase variations across the pupil plane throughout thefield). To achieve this, the adjustment mechanism may be operable tomanipulate one or more optical (e.g., lens) elements within theprojection system PS in one or more different ways. The projectionsystem may have a co-ordinate system wherein its optical axis extends inthe z direction. The adjustment mechanism may be operable to do anycombination of the following: displace one or more optical elements;tilt one or more optical elements; and/or deform one or more opticalelements. Displacement of an optical element may be in any direction (x,y, z or a combination thereof). Tilting of an optical element istypically out of a plane perpendicular to the optical axis, by rotatingabout an axis in the x and/or y directions although a rotation about thez-axis may be used for a non-rotationally symmetric aspherical opticalelement. Deformation of an optical element may include a low frequencyshape (e.g. astigmatic) and/or a high frequency shape (e.g. free formaspheres). Deformation of an optical element may be performed forexample by using one or more actuators to exert force on one or moresides of the optical element and/or by using one or more heatingelements to heat one or more selected regions of the optical element. Ingeneral, it may not be possible to adjust the projection system PS tocorrect for apodization (transmission variation across the pupil plane).The transmission map of a projection system PS may be used whendesigning a patterning device (e.g., mask) MA for the lithographyapparatus LA. Using a computational lithography technique, thepatterning device MA may be designed to at least partially correct forapodization.

The lithographic apparatus may be of a type having two (dual stage) ormore tables (e.g., two or more substrate tables WTa, WTb, two or morepatterning device tables, a substrate table WTa and a table WTb belowthe projection system without a substrate that is dedicated to, forexample, facilitating measurement, and/or cleaning, etc.). In such“multiple stage” machines, the additional tables may be used inparallel, or preparatory steps may be carried out on one or more tableswhile one or more other tables are being used for exposure. For example,alignment measurements using an alignment sensor AS and/or level(height, tilt, etc.) measurements using a level sensor LS may be made.

The lithographic apparatus may also be of a type wherein at least aportion of the substrate may be covered by a liquid having a relativelyhigh refractive index, e.g. water, to fill a space between theprojection system and the substrate. An immersion liquid may also beapplied to other spaces in the lithographic apparatus, for example,between the patterning device and the projection system. Immersiontechniques are well known in the art for increasing the numericalaperture of projection systems. The term “immersion” as used herein doesnot mean that a structure, such as a substrate, must be submerged inliquid, but rather only means that liquid is located between theprojection system and the substrate during exposure.

In operation of the lithographic apparatus, a radiation beam isconditioned and provided by the illumination system IL. The radiationbeam B is incident on the patterning device (e.g., mask) MA, which isheld on the support structure (e.g., mask table) MT, and is patterned bythe patterning device. Having traversed the patterning device MA, theradiation beam B passes through the projection system PS, which focusesthe beam onto a target portion C of the substrate W. With the aid of thesecond positioner PW and position sensor IF (e.g. an interferometricdevice, linear encoder, 2-D encoder or capacitive sensor), the substratetable WT can be moved accurately, e.g. so as to position differenttarget portions C in the path of the radiation beam B. Similarly, thefirst positioner PM and another position sensor (which is not explicitlydepicted in FIG. 1 ) can be used to accurately position the patterningdevice MA with respect to the path of the radiation beam B, e.g. aftermechanical retrieval from a mask library, or during a scan. In general,movement of the support structure MT may be realized with the aid of along-stroke module (coarse positioning) and a short-stroke module (finepositioning), which form part of the first positioner PM. Similarly,movement of the substrate table WT may be realized using a long-strokemodule and a short-stroke module, which form part of the secondpositioner PW. In the case of a stepper (as opposed to a scanner), thesupport structure MT may be connected to a short-stroke actuator only,or may be fixed. Patterning device MA and substrate W may be alignedusing patterning device alignment marks M1, M2 and substrate alignmentmarks P1, P2. Although the substrate alignment marks as illustratedoccupy dedicated target portions, they may be located in spaces betweentarget portions (these are known as scribe-lane alignment marks).Similarly, in situations in which more than one die is provided on thepatterning device MA, the patterning device alignment marks may belocated between the dies.

The depicted apparatus may be used in at least one of the followingmodes:

1. In step mode, the support structure MT and the substrate table WT arekept essentially stationary, while an entire pattern imparted to theradiation beam is projected onto a target portion C at one time (i.e. asingle static exposure). The substrate table WT is then shifted in the Xand/or Y direction so that a different target portion C can be exposed.In step mode, the maximum size of the exposure field limits the size ofthe target portion C imaged in a single static exposure.

2. In scan mode, the support structure MT and the substrate table WT arescanned synchronously while a pattern imparted to the radiation beam isprojected onto a target portion C (i.e. a single dynamic exposure). Thevelocity and direction of the substrate table WT relative to the supportstructure MT may be determined by the (de-) magnification and imagereversal characteristics of the projection system PS. In scan mode, themaximum size of the exposure field limits the width (in the non-scanningdirection) of the target portion in a single dynamic exposure, whereasthe length of the scanning motion determines the height (in the scanningdirection) of the target portion.

3. In another mode, the support structure MT is kept essentiallystationary holding a programmable patterning device, and the substratetable WT is moved or scanned while a pattern imparted to the radiationbeam is projected onto a target portion C. In this mode, generally apulsed radiation source is employed and the programmable patterningdevice is updated as required after each movement of the substrate tableWT or in between successive radiation pulses during a scan. This mode ofoperation can be readily applied to maskless lithography that utilizesprogrammable patterning device, such as a programmable mirror array of atype as referred to above.

Combinations and/or variations on the above-described modes of use orentirely different modes of use may also be employed.

Although specific reference may be made in this text to the use oflithography apparatus in the manufacture of ICs, it should be understoodthat the lithography apparatus described herein may have otherapplications, such as the manufacture of integrated optical systems,guidance and detection patterns for magnetic domain memories,liquid-crystal displays (LCDs), thin film magnetic heads, etc. Theskilled artisan will appreciate that, in the context of such alternativeapplications, any use of the terms “wafer” or “die” herein may beconsidered as synonymous with the more general terms “substrate” or“target portion”, respectively. The substrate referred to herein may beprocessed, before or after exposure, in for example a track (a tool thattypically applies a layer of resist to a substrate and develops theexposed resist) or a metrology or inspection tool. Where applicable, thedisclosure herein may be applied to such and other substrate processingtools. Further, the substrate may be processed more than once, forexample in order to create a multi-layer IC, so that the term substrateused herein may also refer to a substrate that already contains multipleprocessed layers.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) or deepultraviolet (DUV) radiation (e.g. having a wavelength of 365, 248, 193,157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having awavelength in the range of 5-20 nm), as well as particle beams, such asion beams or electron beams.

Various patterns on or provided by a patterning device may havedifferent process windows. i.e., a space of processing variables underwhich a pattern will be produced within specification. Examples ofpattern specifications that relate to potential systematic defectsinclude checks for necking, line pull back, line thinning, CD, edgeplacement, overlapping, resist top loss, resist undercut and/orbridging. The process window of the patterns on a patterning device oran area thereof may be obtained by merging (e.g., overlapping) processwindows of each individual pattern. The boundary of the process windowof a group of patterns comprises boundaries of process windows of someof the individual patterns. In other words, these individual patternslimit the process window of the group of patterns. These patterns can bereferred to as “hot spots” or “process window limiting patterns(PWLPs),” which are used interchangeably herein. When controlling a partof a patterning process, it is possible and economical to focus on thehot spots. When the hot spots are not defective, it is most likely thatother patterns are not defective.

As shown in FIG. 2 , the lithographic apparatus LA may form part of alithographic cell LC, also sometimes referred to as a lithocell orcluster, which also includes apparatuses to perform pre- andpost-exposure processes on a substrate. Conventionally these include oneor more spin coaters SC to deposit one or more resist layers, one ormore developers DE to develop exposed resist, one or more chill platesCH and/or one or more bake plates BK. A substrate handler, or robot, ROpicks up one or more substrates from input/output port I/O1, I/O2, movesthem between the different process apparatuses and delivers them to theloading bay LB of the lithographic apparatus. These apparatuses, whichare often collectively referred to as the track, are under the controlof a track control unit TCU which is itself controlled by thesupervisory control system SCS, which also controls the lithographicapparatus via lithography control unit LACU. Thus, the differentapparatuses can be operated to maximize throughput and processingefficiency.

In order that a substrate that is exposed by the lithographic apparatusis exposed correctly and consistently and/or in order to monitor a partof the patterning process (e.g., a device manufacturing process) thatincludes at least one pattern transfer step (e.g., an opticallithography step), it is desirable to inspect a substrate or otherobject to measure or determine one or more properties such as alignment,overlay (which can be, for example, between structures in overlyinglayers or between structures in a same layer that have been providedseparately to the layer by, for example, a double patterning process),line thickness, critical dimension (CD), focus offset, a materialproperty, etc. Accordingly, a manufacturing facility in which lithocellLC is located also typically includes a metrology system MET thatmeasures some or all of the substrates W that have been processed in thelithocell or other objects in the lithocell. The metrology system METmay be part of the lithocell LC, for example, and/or it may be part ofthe lithographic apparatus LA (such as alignment sensor AS).

The one or more measured parameters may include, for example, overlaybetween successive layers formed in or on the patterned substrate,critical dimension (CD) (e.g., critical linewidth) of, for example,features formed in or on the patterned substrate, focus or focus errorof an optical lithography step, dose or dose error of an opticallithography step, optical aberrations of an optical lithography step,etc. This measurement may be performed on a target of the productsubstrate itself and/or on a dedicated metrology target provided on thesubstrate. The measurement can be performed after-development of aresist (ADI) but before etching, or may be performed after-etch (AEI),or both as described herein.

There are various techniques for making measurements of the structuresformed in the patterning process, including the use of a scanningelectron microscope, an image-based measurement tool and/or variousspecialized tools. As discussed above, a fast and non-invasive form ofspecialized metrology tool is one in which a beam of radiation isdirected onto a target on the surface of the substrate and properties ofthe scattered (diffracted/reflected) beam are measured. By evaluatingone or more properties of the radiation scattered by the substrate, oneor more properties of the substrate can be determined. This may betermed diffraction-based metrology. One such application of thisdiffraction-based metrology is in the measurement of feature asymmetrywithin a target. This can be used as a measure of overlay, for example,but other applications are also known. For example, asymmetry can bemeasured by comparing opposite parts of the diffraction spectrum (forexample, comparing the −1st and +1^(st) orders in the diffractionspectrum of a periodic grating). This can be done as described above andas described, for example, in U.S. patent application publication US2006-066855, which is incorporated herein in its entirety by reference.Another application of diffraction-based metrology is in the measurementof feature width (CD) within a target. Such techniques can use theapparatus and methods described hereafter.

Thus, in a device fabrication process (e.g., a patterning process or alithography process), a substrate or other objects may be subjected tovarious types of measurement during or after the process. Themeasurement may determine whether a particular substrate is defective,may establish adjustments to the process and apparatuses used in theprocess (e.g., aligning two layers on the substrate or aligning thepatterning device to the substrate), may measure the performance of theprocess and the apparatuses, or may be for other purposes. Examples ofmeasurement include optical imaging (e.g., optical microscope),non-imaging optical measurement (e.g., measurement based on diffractionsuch as the ASML YieldStar metrology tool, the ASML SMASH metrologysystem), mechanical measurement (e.g., profiling using a stylus, atomicforce microscopy (AFM)), and/or non-optical imaging (e.g., scanningelectron microscopy (SEM)). The SMASH (SMart Alignment Sensor Hybrid)system, as described in U.S. Pat. No. 6,961,116, which is incorporatedby reference herein in its entirety, employs a self-referencinginterferometer that produces two overlapping and relatively rotatedimages of an alignment marker, detects intensities in a pupil planewhere Fourier transforms of the images are caused to interfere, andextracts the positional information from the phase difference betweendiffraction orders of the two images which manifests as intensityvariations in the interfered orders.

Metrology results may be provided directly or indirectly to thesupervisory control system SCS. If an error is detected, an adjustmentmay be made to exposure of a subsequent substrate (especially if theinspection can be done soon and fast enough that one or more othersubstrates of the batch are still to be exposed) and/or to subsequentexposure of the exposed substrate. Also, an already exposed substratemay be stripped and reworked to improve yield, or discarded, therebyavoiding performing further processing on a substrate known to befaulty. In a case where only some target portions of a substrate arefaulty, further exposures may be performed only on those target portionsthat meet specifications.

Within a metrology system MET, a metrology apparatus is used todetermine one or more properties of the substrate, and in particular,how one or more properties of different substrates vary or differentlayers of the same substrate vary from layer to layer. As noted above,the metrology apparatus may be integrated into the lithographicapparatus LA or the lithocell LC or may be a stand-alone device.

To enable the metrology, one or more targets can be provided on thesubstrate. In an embodiment, the target is specially designed and maycomprise a periodic structure. In an embodiment, the target is a part ofa device pattern, e.g., a periodic structure of the device pattern. Inan embodiment, the device pattern is a periodic structure of a memorydevice (e.g., a Bipolar Transistor (BPT), a Bit Line Contact (BLC), etc.structure).

In an embodiment, the target on a substrate may comprise one or more 1-Dperiodic structures (e.g., gratings), which are printed such that afterdevelopment, the periodic structural features are formed of solid resistlines. In an embodiment, the target may comprise one or more 2-Dperiodic structures (e.g., gratings), which are printed such that afterdevelopment, the one or more periodic structures are formed of solidresist pillars or vias in the resist. The bars, pillars, or vias mayalternatively be etched into the substrate (e.g., into one or morelayers on the substrate).

In an embodiment, one of the parameters of interest of a patterningprocess is overlay. Overlay can be measured using dark fieldscatterometry in which the zeroth order of diffraction (corresponding toa specular reflection) is blocked, and only higher orders processed.Examples of dark field metrology can be found in PCT patent applicationpublication nos. WO 2009/078708 and WO 2009/106279, which are herebyincorporated in their entirety by reference. Further developments of thetechnique have been described in U.S. patent application publicationsUS2011-0027704, US2011-0043791 and US2012-0242970, which are herebyincorporated in their entirety by reference. Diffraction-based overlayusing dark-field detection of the diffraction orders enables overlaymeasurements on smaller targets. These targets can be smaller than theillumination spot and may be surrounded by device product structures ona substrate. In an embodiment, multiple targets can be measured in oneradiation capture.

FIG. 3 depicts an example inspection apparatus (e.g., a scatterometer).It comprises a broadband (white light) radiation projector 2 whichprojects radiation onto a substrate W. The redirected radiation ispassed to a spectrometer detector 4, which measures a spectrum 10(intensity as a function of wavelength) of the specular reflectedradiation, as shown, e.g., in the graph in the lower left of FIG. 3 .From this data, the structure or profile giving rise to the detectedspectrum may be reconstructed by processor PU, e.g. by Rigorous CoupledWave Analysis and non-linear regression or by comparison with a libraryof simulated spectra as shown at the bottom right of FIG. 3 . Ingeneral, for the reconstruction the general form of the structure isknown and some variables are assumed from knowledge of the process bywhich the structure was made, leaving only a few variables of thestructure to be determined from the measured data. Such an inspectionapparatus may be configured as a normal-incidence inspection apparatusor an oblique-incidence inspection apparatus.

Another inspection apparatus that may be used is shown in FIG. 4 . Inthis device, the radiation emitted by radiation source 2 is collimatedusing lens system 12 and transmitted through interference filter 13 andpolarizer 17, reflected by partially reflecting surface 16 and isfocused into a spot S on substrate W via an objective lens 15, which hasa high numerical aperture (NA), desirably at least 0.9 or at least 0.95.An immersion inspection apparatus (using a relatively high refractiveindex fluid such as water) may even have a numerical aperture over one.

As in the lithographic apparatus LA, one or more substrate tables may beprovided to hold the substrate W during measurement operations. Thesubstrate tables may be similar or identical in form to the substratetable WT of FIG. 1 . In an example where the inspection apparatus isintegrated with the lithographic apparatus, they may even be the samesubstrate table. Coarse and fine positioners may be provided to a secondpositioner PW configured to accurately position the substrate inrelation to a measurement optical system. Various sensors and actuatorsare provided, for example to acquire the position of a target ofinterest, and to bring it into position under the objective lens 15.Typically many measurements will be made on targets at differentlocations across the substrate W. The substrate support can be moved inX and Y directions to acquire different targets, and in the Z directionto obtain a desired location of the target relative to the focus of theoptical system. It is convenient to think and describe operations as ifthe objective lens is being brought to different locations relative tothe substrate, when, for example, in practice the optical system mayremain substantially stationary (typically in the X and Y directions,but perhaps also in the Z direction) and only the substrate moves.Provided the relative position of the substrate and the optical systemis correct, it does not matter in principle which one of those is movingin the real world, or if both are moving, or a combination of a part ofthe optical system is moving (e.g., in the Z and/or tilt direction) withthe remainder of the optical system being stationary and the substrateis moving (e.g., in the X and Y directions, but also optionally in the Zand/or tilt direction).

The radiation redirected by the substrate W then passes throughpartially reflecting surface 16 into a detector 18 in order to have thespectrum detected. The detector 18 may be located at a back-projectedfocal plane 11 (i.e., at the focal length of the lens system 15) or theplane 11 may be re-imaged with auxiliary optics (not shown) onto thedetector 18. The detector may be a two-dimensional detector so that atwo-dimensional angular scatter spectrum of a substrate target 30 can bemeasured. The detector 18 may be, for example, an array of CCD or CMOSsensors, and may use an integration time of, for example, 40milliseconds per frame.

A reference beam may be used, for example, to measure the intensity ofthe incident radiation. To do this, when the radiation beam is incidenton the partially reflecting surface 16 part of it is transmitted throughthe partially reflecting surface 16 as a reference beam towards areference mirror 14. The reference beam is then projected onto adifferent part of the same detector 18 or alternatively on to adifferent detector (not shown).

One or more interference filters 13 are available to select a wavelengthof interest in the range of, say, 405-790 nm or even lower, such as200-300 nm. The interference filter may be tunable rather thancomprising a set of different filters. A grating could be used insteadof an interference filter. An aperture stop or spatial light modulator(not shown) may be provided in the illumination path to control therange of angle of incidence of radiation on the target.

The detector 18 may measure the intensity of redirected radiation at asingle wavelength (or narrow wavelength range), the intensity separatelyat multiple wavelengths or integrated over a wavelength range.Furthermore, the detector may separately measure the intensity oftransverse magnetic- and transverse electric-polarized radiation and/orthe phase difference between the transverse magnetic- and transverseelectric-polarized radiation.

The target 30 on substrate W may be a 1-D grating, which is printed suchthat after development, the bars are formed of solid resist lines. Thetarget 30 may be a 2-D grating, which is printed such that afterdevelopment, the grating is formed of solid resist pillars or vias inthe resist. The bars, pillars or vias may be etched into or on thesubstrate (e.g., into one or more layers on the substrate). The pattern(e.g., of bars, pillars or vias) is sensitive to change in processing inthe patterning process (e.g., optical aberration in the lithographicprojection apparatus (particularly the projection system PS), focuschange, dose change, etc.) and will manifest in a variation in theprinted grating. Accordingly, the measured data of the printed gratingis used to reconstruct the grating. One or more parameters of the 1-Dgrating, such as line width and/or shape, or one or more parameters ofthe 2-D grating, such as pillar or via width or length or shape, may beinput to the reconstruction process, performed by processor PU, fromknowledge of the printing step and/or other inspection processes.

In addition to measurement of a parameter by reconstruction, angleresolved scatterometry is useful in the measurement of asymmetry offeatures in product and/or resist patterns. A particular application ofasymmetry measurement is for the measurement of overlay, where thetarget 30 comprises one set of periodic features superimposed onanother. The concepts of asymmetry measurement using the instrument ofFIG. 3 or FIG. 4 are described, for example, in U.S. patent applicationpublication US2006-066855, which is incorporated herein in its entirety.Simply stated, while the positions of the diffraction orders in thediffraction spectrum of the target are determined only by theperiodicity of the target, asymmetry in the diffraction spectrum isindicative of asymmetry in the individual features that make up thetarget. In the instrument of FIG. 4 , where detector 18 may be an imagesensor, such asymmetry in the diffraction orders appears directly asasymmetry in the pupil image recorded by detector 18. This asymmetry canbe measured by digital image processing in unit PU, and calibratedagainst known values of overlay.

FIG. 5 illustrates a plan view of a typical target 30, and the extent ofillumination spot S in the apparatus of FIG. 4 . To obtain a diffractionspectrum that is free of interference from surrounding structures, thetarget 30, in an embodiment, is a periodic structure (e.g., grating)larger than the width (e.g., diameter) of the illumination spot S. Thewidth of spot S may be smaller than the width and length of the target.The target in other words is ‘underfilled’ by the illumination, and thediffraction signal is essentially free from any signals from productfeatures and the like outside the target itself. The illuminationarrangement 2, 12, 13, 17 (FIG. 4 ) may be configured to provideillumination of a uniform intensity across a back focal plane ofobjective 15. Alternatively, by, e.g., including an aperture in theillumination path, illumination may be restricted to on axis or off axisdirections.

FIG. 6 schematically depicts an example process of the determination ofthe value of one or more variables of interest of a target pattern 30based on measurement data obtained using metrology. Radiation detectedby the detector 18 provides a measured radiation distribution 608 fortarget 30. For a given target 30, a radiation distribution 612 can becomputed/simulated from a parameterized model 606 using, for example, anumerical Maxwell solver 610. The parameterized model 606 shows examplelayers of various materials making up, and associated with, the target.The parameterized model 606 may include one or more variables for thefeatures and layers of the portion of the target under consideration,which may be varied and derived. As shown in FIG. 6 , the one or more ofthe variables may include the thickness t of one or more layers, a widthw (e.g., CD) of one or more features, a height h of one or morefeatures, and/or a sidewall angle α of one or more features. Althoughnot shown, the one or more of the variables may further include, but isnot limited to, the refractive index (e.g., a real or complex refractiveindex, refractive index tensor, etc.) of one or more of the layers, theextinction coefficient of one or more layers, the absorption of one ormore layers, resist loss during development, a footing of one or morefeatures, and/or line edge roughness of one or more features. Theinitial values of the variables may be those expected for the targetbeing measured. The measured radiation distribution 608 is then comparedat 612 to the computed radiation distribution 612 to determine thedifference between the two. If there is a difference, the values of oneor more of the variables of the parameterized model 606 may be varied, anew computed radiation distribution 612 calculated and compared againstthe measured radiation distribution 608 until there is sufficient matchbetween the measured radiation distribution 608 and the computedradiation distribution 612. At that point, the values of the variablesof the parameterized model 606 provide a good or best match of thegeometry of the actual target 30. In an embodiment, there is sufficientmatch when a difference between the measured radiation distribution 608and the computed radiation distribution 612 is within a tolerancethreshold.

FIG. 7A shows a flowchart that lists the main stages of a “design forcontrol” (D4C) method. In stage 710, the materials to be used in thelithography process are selected. The materials may be selected from amaterials library interfaced with D4C through an appropriate GUI. Instage 720, a lithography process is defined by entering each of theprocess steps, and building a computer simulation model for the entireprocess sequence. In stage 730, a metrology target is defined, i.e.dimensions and other characteristics of various features included in thetarget are entered into the D4C program. For example, if a grating isincluded in a structure, then number of grating elements, width ofindividual grating elements, spacing between two grating elements etc.have to be defined. In stage 740, the 3D geometry is created. This stepalso takes into account whether there is any information relevant to amulti-layer target design, for example, the relative shifts betweendifferent layers. This feature enables multi-layer target design. Instage 750, the final geometry of the designed target is visualized. Aswill be explained in greater detail below, not only the final design isvisualized, but as the designer applies various steps of the lithographyprocess, he/she can visualize how the 3D geometry is being formed andchanged because of process-induced effects (e.g., caused by localelectric fields as described herein). For example, the 3D geometry afterresist patterning is different from the 3D geometry after resist removaland etching.

An important aspect of the present disclosure is that the targetdesigner is enabled to visualize the stages of the method to facilitatetheir perception and control during modeling and simulation. Differentvisualization tools, referred to as “viewers,” are built into the D4Csoftware. For example, as shown in FIG. 7B, a designer can view materialplots 760 (and may also get a run time estimation plot) depending on thedefined lithography process and target. Once the lithography model iscreated, the designer can view the model parameters through model viewertool 775. Design layout viewer tool 780 may be used to view the designlayout (e.g., visual rendering of the GDS file). Resist profile viewertool 785 may be used to view pattern profiles in a resist. Geometryviewer tool 790 may be used to view 3D structures on a substrate. Apupil viewer tool 795 may be used to view simulated response on ametrology tool. Persons skilled in the art would understand that theseviewing tools are available to enhance the understanding of the designerduring design and simulation. One or more of these tools may not bepresent in some embodiments of D4C software, and additional viewingtools may be there in some other embodiments.

FIG. 7C shows a flow chart that illustrates how the D4C processincreases efficiency in the overall simulation process by reducing thenumber of metrology targets selected for the actual simulation of thelithography process. As mentioned before, D4C enables designers todesign thousands or even millions of designs. Not all of these designsmay be robust against variations in the process steps. To select asubset of target designs that can withstand process variation, alithographer may intentionally perturb one or more steps of the definedlithography process, as shown in block 752. The introduction of theperturbation alters the entire process sequence with respect to how itwas originally defined. Therefore, applying the perturbed processsequence (block 754) alters the 3D geometry of the designed target too.A lithographer only selects the perturbations that show nonzeroalternations in the original design targets and creates a subset ofselected process perturbations (block 756). The lithography process isthen simulated with this subset of process perturbations (block 758).

The manufacturing or fabrication of a substrate using the lithographicprocess (or patterning process in general) typically involves processvariations. The process variations are not uniform across the substrate.For example, in deposition processes, films tend to be thicker at thecenter of the substrate and thinner when close to edge. These systematicvariations are usually reflected in measurements data as ‘fingerprints’,which are characteristics of a substrate based on known processconditions. In other words, there exists a stack on a substrate that hasa spatial variation as a function of substrate coordinate. A stackcomprises multiple layers formed on a substrate during the patterningprocess to form a selected pattern (e.g., a design pattern) on thesubstrate. Each layer of the stack can be associated with a thickness,material properties, electrical and/or magnetic properties, and featuresand related parameters of the patterning process (e.g. CD, pitch,overlay, etc.).

As described above, the global electric field distribution inside anetch tool has a significant effect on how the structures defined inphoto resist will be transferred into the underlying substrate. As anexample, FIG. 8 a illustrates a global electric field 800 associatedwith a wafer 802 and a focus ring 804. FIG. 8 a illustrates a portion806 of global electric field 800 that is affected by focus ring 804.Global electric field 800 including portion 806 that is affected byfocus ring 804 causes a difference in after development inspection (ADI)and after etch in inspection (AEI) values (e.g., the ADI-AEI penalty),and/or may have other effects.

Apart from the global electric field distribution (e.g., introduced bythe etch tool), local electric fields also have an impact on the afteretch wafer structure (and thus the ADI-AEI penalty). Since featuresinside an integrated circuit are electrically conducting and eitherfloating or at a fixed potential, they influence a local intra-fieldand/or intra-die local electric field and/or etch performance. Ingeneral, three levels of granularity may be considered that impact thelocal electric field distribution: intra-die pattern density, an overlaymetrology target (or other wafer feature) itself, and the local devicestructures.

As a non-limiting example, FIG. 8 b illustrates modeled devicestructures 810 on a wafer 812 and the effect local electric fieldsimpacted by a buried conducting wafer layer 814 have on metrologytargets 816 (or any other feature to be etched). In FIG. 8 b , arrows818 represent the ADI-AEI penalty (which can be thought of as a relativeshift in position from a previous and/or intended location to a currentand/or actual location on a layer of wafer 812) for each metrologytarget 816. The ADI-AEI penalty is caused by local electric fieldsimpacted by buried conduction wafer layer 814. The size and direction ofarrows 818 (e.g., the relative direction and amount of shift inlocation), for example, depend on the layout of buried conduction waferlayer 814, locations of metrology targets 816 relative to the differentportions of buried conduction wafer layer 814, and/or other factors thatimpact local electric fields.

By way of additional non-limiting examples, FIG. 9 a-9 d illustrateimpacts local electric fields may have on etch processes. FIG. 9 aillustrates two modeled cross sections 900 of layers 902 of a portion ofa wafer stack. As shown in FIG. 9 a , local electric field 904 mayinfluence whether partial 906 or full 908 etching occurs during an etchprocess. In this example, local electric field 904 influences a tiltangle of the etch (e.g., an angle of the etch corresponds to an angle oflocal electric field 904). In the example shown in FIG. 9 a (e.g., inconjunction with FIG. 8 b ), local electric fields 904 (e.g.,disturbances caused by areas 814 shown in FIG. 8 b ) influence the etchdirection of any patterned structure 910. The tilted local electricfields induced by different areas inside a chip cause different tilts inan etch in one area of a wafer compared to another, for example. Insidea die/chip, different conducting areas (e.g., buried layers 814) existthat influence the local electric field and hence the etch direction.The etch direction would be similar for target (e.g., Yieldstar) topgratings or other device structures.

FIG. 9 b illustrates two modeled cross sections 920 of layers 902 ofanother portion of the wafer stack. As shown in FIG. 9 b , localelectric field 922 influences etches 924 and 926 for +d and −d gratings(at OV=0 nm in this example) of the metrology target. Bottom (orotherwise lower or buried) gratings 928 and 930 may be conducting forexample. In this example, ADI-AEI depends on local electric field 922,which is impacted by the presence of bottom conductive gratings 928 and930. In other words, the conducting (e.g., Yieldstar) target (bottomgrating) itself may cause a tilt in the etch direction of thetop-grating. Other local surrounding structure of the metrology target(such as a design of top grating 921 and/or other structure) may alsoinfluence local electric field 922. ADI-AEI is a function of overlay(ADI). Often, a hard mask uses conducting material that influence thelocal electric fields. It can also be a dummy pattern surrounding atarget.

FIG. 9 c illustrates two modeled cross sections 940 of layers 902 ofanother portion of the wafer stack. As shown in FIG. 9 c , localelectric field 942 influences etches 948 and 950 for +d and −d gratings(at OV>0 nm in this example) of the metrology target. Bottom (orotherwise lower or buried) gratings 944 and 946 may again be conducting.As in FIG. 9 b , ADI-AEI depends on local electric field 942 because ofthe presence of bottom conductive gratings 944 and 946. Other localsurrounding structure of the metrology target (such as a design of topgrating 941 and/or other structure) may also influence local electricfield 942. ADI-AEI is again a function of overlay (ADI).

FIG. 9 d illustrates another modeled cross section 960 of layers 902 ofanother portion of the wafer stack. FIG. 9 d illustrates various contacthole etches 962, 964, 966, 968, 970, and 972 in the wafer stack. Ashape, size, angle, and/or other characteristics of these contact holeetches may depend on surrounding conducting and/or charge carryingstructures in the wafer stack. These characteristics may influence thelocal electric field around individual contact hole etches 962-972. Thelocal electric field is not shown for clarity of FIG. 9 d , but mayinclude a local electric field similar to or the same as local electricfields 942, 922, and/or 904 shown in FIG. 9 a-9 c . As shown in FIG. 9 d, a bottom (or otherwise lower or buried) layer 974 may be conducting.As shown in FIG. 9 d , bottom conductive layer 974 may impact the localelectric field such that different contact holes etch differently. Inthis example, the local electric field may influence the etch angle ofone or more of the contact hole etches. For example, an etch angle ofcontact hole etch 962 may be generally vertical because a contact holegap 975 in an upper layer 976 is generally aligned with the middle (or anon-edge location) of a portion 978 of bottom conductive layer 974. Thesame is true of contact hole etches 970 and 972. In contrast, an etchangle of contact hole etches 964, 966, and 968 may be angled becausecontact hole gaps 977, 979, and 981 in upper layer 976 are generallyaligned with edge locations of portions 978, 980, and 982 of bottomconductive layer 974 (e.g., if local electric field arrows were drawn onFIG. 9 d , the local electric field arrows would be angled at anglesthat correspond to the angles of contact hole etches 964, 966, and 968).

In some instances, a local electric field may cause unintended contactbetween a contact hole and underlying structure (e.g., resulting in ashort). For example, as shown in FIG. 9 d , the local electric fieldcauses contact hole etch 966 to angle toward and touch portion 980 ofbottom conductive layer 974. This unintended contact may cause anintegrated circuit to malfunction, for example, or have otherconsequences. Other examples of negative effects of not consideringlocal electric fields (on metrology targets as in FIG. 9 a-9 c , or onother wafer features such as contact holes as in FIG. 9 d ) arecontemplated.

Current overlay metrology targets and/or other wafer features aretypically optimized based on stack material properties and theirsensitivity to processing perturbations (e.g., etch, CMP, layerthickness, etc.). Effects of a corresponding global electric field areoften accounted for in process models. However, the impact of localelectric fields near a target feature (e.g., a metrology target, IDM,SEM, e-test and/or other registration features, wafer alignment marks,one or more features in a mask layout design, and/or other waferfeatures) that are introduced by a local environment of the wafer at ornear that target feature are not considered in prior systems. Forexample, as shown in FIG. 9 a-9 d , a local electric field impacted by alocal structure of the top and/or bottom layers of a metrology target,which may affect etch depth, etch angle, and/or other characteristics ofan etch process, is not considered in prior systems. Advantageously, thepresent systems and methods account for local electric fields duringtarget feature (e.g., metrology target, and/or other mask layout designfeature) optimization. The present systems and methods may enhance (orotherwise optimize) a target feature by adding substructures at or neara target feature (e.g., to a grating design), adjust feature (e.g.,metrology target) placement with respect to surrounding mask or waferstructures, adding dummy features that influence the local electricfields, solving Poisson's equation to determine the strength and/ororientation of a given local electric field, and/or by performing otheroperations as described herein.

For example, continuing with FIG. 9 a-9 d , FIG. 9 e illustrates twomodeled cross sections 990 of layers 992 of a portion of a metrologytarget that has been enhanced using the present systems and/or methodsby adding substructures and/or dummy features 994 to the grating designbased on the local electric field 996 associated with that portion ofthe metrology target. As shown in FIG. 9 e , local electric field 996does not influence etches 998 and 999 for +d and −d gratings of themetrology target as in previous examples shown in FIGS. 9 b and 9 c(e.g., etches 998 and 999 are substantially vertically oriented relativeto layers 992). This is because, although bottom (or otherwise lower orburied) gratings 991 and 993 may still be conducting, they now includesubstructures and/or dummy features 994. In this example, ADI-AEIdepends on local electric field 996, which is impacted by the presenceof bottom conductive gratings 991 and 993 with substructures and/ordummy features 994. A goal may be to make ADI-AEI zero by addingsubstructures. In the case where the electric field is perpendicular tothe wafer surface, AEI is equal to ADI, for example. Other localsurrounding structure of the metrology target (such as a design of topgrating 997 and/or other structure) may also influence local electricfield 922.

FIG. 10 and FIG. 11 illustrate methods 1050 (FIG. 10 ) and 1100 (FIG. 11) for adjusting a target feature in a model of a patterning processbased on local electric fields estimated for the patterning process.These methods may be used by a simulation system as described herein, orfor other purposes. Method 1050 is described in the context of ametrology target design, and method 1100 is described in the context ofa mask layout design, but this is not intended to be limiting. Method1050 and 1100 may be generally applied to a number of differentprocesses where determining an impact of local electric fields isuseful. Methods 1050 and/or 1100 may be used to develop overlaymetrology targets, mask layout designs, and/or any other integratedcircuit features and/or other features that are substantiallyinsensitive to local electric fields.

In some embodiments, method 1050 may be used to determine a (clean)ADI-AEI measurement for use as input for etch tool optimization andcontrol, and/or for other purposes. As shown in FIG. 10 , method 1050comprises obtaining 1052 a mask stack region of interest. The mask stackregion of interest has one or more characteristics associated withpropagation of electromagnetic waves through the mask stack region ofinterest. For clarity, this refers to the detection wavelengths tomeasure the overlay (e.g., Yieldstar wavelengths). The static electricfield is only present during etch inside the etch tool. In someembodiments, the mask stack region of interest is divided into subregions such as layers. In some embodiments, obtaining 1052 the maskstack region of interest comprises obtaining the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest. In some embodiments, the oneor more characteristics associated with propagation of electromagneticwaves through the mask stack region of interest comprise stackcharacteristics including one or more of layer properties, stack designrules, layer integration requirements, a layer interaction order, and/orother characteristics. In some embodiments (e.g., during the modelingphase to model the impact on the structure to be etched), the one ormore characteristics associated with propagation of electromagneticwaves through the mask stack region of interest include a globalelectric field associated with the mask stack region of interest (butphysically, the one or more characteristics associated with thepropagation of electromagnetic waves through the mask stack region ofinterest include the global electric field only during etch of thepatterned layer and not during the overlay measurements after etch(AEI)).

In some embodiments, the one or more characteristics associated withpropagation of electromagnetic waves through the mask stack region ofinterest comprise characteristics of the mask stack region of interestthat cause and/or impact a local electric field. Characteristics of themask stack region of interest that cause and/or impact a local electricfield include stack layer thicknesses, materials used to form stacklayers, a conductivity of stack layers or portions of stack layers, astack layer order (e.g., conductive layers separated by an insulatinglayer), a proximity of specific layers (e.g., a distance between twoconducting layers), a temperature of the mask stack region of interest,a pressure inside an etch chamber, an RF power and/or othercharacteristics.

The mask stack region of interest may be a target area of aphotolithography mask model, for example. The mask stack region ofinterest includes the target feature. The target feature may include oneor more layers, one or more materials, one or more apertures, and/orother features. In some embodiments, one or more material properties maybe associated with one of more of the layers. Individual layers may havetheir own individual parameters. In some embodiments, as in method 1050,the target feature is a metrology target design.

Method 1050 includes obtaining 1054 the metrology target design. In someembodiments, obtaining the metrology target design comprises obtainingand/or determining metrology target design characteristics including oneor more of a top grating design, contrast, a bottom grating design,materials used to form the layers of the metrology target, a proximityof features of the metrology target design, and/or other metrologytarget design characteristics. In some embodiments, the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise the metrology targetdesign characteristics.

In some embodiments, obtaining the mask stack region of interest, themetrology target design, characteristics associated with the mask stackregion of interest and/or the metrology target design (e.g., operations1052 and/or 1054), and/or other information may include electronicallyaccessing this information via databases of one or more externalcomputing systems, accessing this information in local electronicstorage, receiving or accessing this information via networkcommunications, receiving this information via upload, download, orother electronic file transfer from non-transitory storage media and/orother electronic storage sources, or obtaining this information by othermethods. As an example, designed dimensions and/or other features of amask stack region of interest and/or the metrology target design may beentered or selected by, or otherwise communicated from, a user via auser interface associated with design software (e.g., D4C) or otherresources. As another example, dimensions or other features of a maskstack region of interest and/or the metrology target design may bemeasured as part of operation 1052 and/or 1054. Such measurements may betaken, for example, on an immediately previous layer of a physical ormodeled wafer going through a fabrication process. In some embodiments,the mask stack region of interest and/or the metrology target design mayalso be built based on assumptions made by a designer, the system, orother sources.

Method 1050 comprises estimating 1056 the local electric field based onthe one or more characteristics associated with the propagation ofelectromagnetic waves through the mask stack region of interest. Thelocal electric field is estimated for a portion of the mask stack regionof interest in proximity to the metrology target design (or any othertarget feature the target feature).

Method 1050 comprises adjusting 1058 the metrology target design basedon the estimated local electric field and/or other information. Themetrology target design may be adjusted one or more times based on thelocal electric field and/or the other information to enhance themetrology target design. In some embodiments, adjusting 1058 themetrology target design one or more times to enhance the metrologytarget design comprises one or more of adjusting placement of componentsof the metrology target relative to each other, adjusting placement ofthe metrology target relative to other features in a mask layout design,adding one or more dummy features to the metrology target design, and/orother operations. For example, previously discussed FIG. 9 e illustratesa metrology target that has been enhanced according to method 1050 byadding substructures and/or dummy features 994 to the grating designbased on the local electric field 996 associated with that portion ofthe metrology target. As shown in FIG. 9 e , local electric field 996does not influence etches 998 and 999 for +d and −d gratings of themetrology target as in previous examples shown in FIGS. 9 b and 9 c(e.g., etches 998 and 999 are substantially vertically oriented relativeto layers 992). This is because, although bottom (or otherwise lower orburied) gratings 991 and 993 may still be conducting, they now includesubstructures and/or dummy features 994. Returning to FIG. 10 , in someembodiments, adjusting 1058 the metrology target design based on theestimated local electric field and/or other information comprisesoptimizing the metrology target design, for example.

In some embodiments, estimating 1056 the local electric field and/oradjusting 1058 the metrology target design based on the estimated localelectric field and/or other information comprises determining an effectof the estimated local electric field on the metrology target designduring an etch of the patterning process, and adjusting the metrologytarget design based on the estimated effect on the metrology targetdesign during the etch. In some embodiments, determining the effect ofthe estimated local electric field on the metrology target designcomprises determining an induced charge on conducting components in theportion of the mask stack region of interest in proximity to themetrology target design (e.g., a top or bottom grating of the metrologytarget, conductive wafer features in proximity to the metrology target,etc.), solving Poisson's Equation to determine the strength and/ororientation of the local electric field caused by such features, and/orother operations.

By way of a non-limiting example, solving Poisson's equation will bedone numerically. A constant potential may be assigned to two largecapacitor plates (representing the etch tool). Alternatively, a constantelectric field may be assumed at the location of the features to beetched. Conducting features will have a constant potential (inside theconductor the E-field is zero). By solving Poisson's Equationnumerically outside the conducting feature, one obtains the potentialdistribution. The derivative of the potential distribution isproportional to the electric field. The induced charge on a buriedconducting feature can be calculated as well, but this is not required.

In some embodiments, one or more of operations 1052-1058 of method 1050may comprise outputting an indication of the characteristics of the maskstack region of interest, the metrology target design, the estimatedlocal electric field and/or the effect of the estimated local electricfield on the metrology target design, and/or other information forreview by a user. In some embodiments, these operations may includereceiving entries and/or selections from the user (e.g., via one or morecomputer system components described below) that indicate adjustments tothe mask stack region of interest, the metrology target design, theestimated local electric field and/or the effect of the estimated localelectric field on the metrology target design, and/or other informationdesired by the user. Method 1050 may include repeating one or more ofoperations 1052-1058 to adjust the metrology target design based on anupdated estimated local electric field generated from the inputs and/orselections made by the user.

In some embodiments, method 1050 comprises iteratively repeating theestimating of the local electric field and/or the impact of the localelectric field on the etch of the metrology target design, and theadjusting of the target feature one or more times to enhance themetrology target design. For example, if the metrology target design isto be further enhanced (“yes” 1059 in FIG. 1050 ), a current version ofthe metrology target design is fed back into operation 1054 andoperations 1054 and 1056 are iteratively repeated as described above.

In some embodiments, method 1050 further comprises (following “no” 1061in FIG. 10 ) enhancing the metrology target design based on the localelectric field to reduce an overlay penalty (ADI−AEI). In someembodiments, method 1050 further comprises determining 1060 whether acorrection for an AEI overlay measurement is necessary (and, following“yes” 1063 in FIG. 10 , determining and providing 1062 that correctionif it is necessary), and/or, following “no” 1065 in FIG. 10 ,determining 1064 the AEI overlay measurement, based on the enhancedmetrology target design. One may use operations 1060, 1062, and/or 1063,for example, on existing overlay targets that already are in use. Theoverlay readings after etch may be corrected to obtain a more accurateoverlay measurement. One may also encounter use cases where the overlaytarget contrast becomes insufficient when sub-structures are added. Inthis case, the overlay penalty during the measurement can be correctedafterwards.

In some embodiments, method 1100 shown in FIG. 11 may be used to developa device local electric field-aware layout optimization, and/or forother purposes. A device local electric field-aware layout optimizationmay, for example, be achieved by mask splitting in multi-patterningapplications and/or other operations. With reference to FIG. 9 d (devicepattern), for example, and/or other figures, method 1100 is configuredsuch that the device pattern (e.g. contact holes) are placed such thatthey are not negatively impacted by the etch process and cause defects.Method 1100 is meant to optimize the mask(s) used for exposure, takingthe conductive layer that is already present on the wafer.Alternatively, sub-structures can be added to the conducting layer to“guide” the etch direction.

In method 1100 shown in FIG. 11 the target feature is a mask layoutdesign. Similar to method 1050 shown in FIG. 10 , as shown in FIG. 11 ,method 1100 comprises obtaining 1102 the mask stack region of interest.Again, the mask stack region of interest may be a target area of aphotolithography mask model that includes the mask layout design, forexample. In embodiments where the target feature is the mask layoutdesign, the mask stack region of interest may comprise a relativelylarge portion (up to and including all) of a mask and/or wafer. The masklayout design may include one or more layers, one or more materials, oneor more apertures, and/or other features. In some embodiments, one ormore material properties may be associated with one of more of thelayers. Individual layers may have their own individual parameters thatcause and/or impact local electric fields in the mask stack region ofinterest. In some embodiment, the one or more characteristics associatedwith propagation of electromagnetic waves through the mask stack regionof interest comprise mask layout design characteristics including anarrangement of features relative to each other, proximity of conductingportions of individual layers to each other, a location of a portion ofa mask layout design relative to an edge and/or a center of a wafer inthe model of the patterning process, and/or other characteristics.Operation 1102 includes obtaining the characteristics of the mask stackregion of interest, characteristics of the mask layout design, and/orother information associated with propagation of electromagnetic wavesthrough the mask stack region of interest, a global electric fieldassociated with the mask stack region of interest, characteristics thatcause and/or impact a local electric field, and/or other information.

Method 1100 comprises estimating 1104 the local electric field based onthe one or more characteristics associated with the propagation ofelectromagnetic waves through the mask stack region of interest. Thelocal electric field may be estimated for one or more individual areasof the mask layout design and/or may be estimated across the mask layoutdesign. Method 1100 also comprises adjusting 1106 the mask layout designbased on the estimated local electric field(s) and/or other information.The mask layout design may be adjusted one or more times based on thelocal electric field and/or other information to enhance the mask layoutdesign. In some embodiments, adjusting 1106 the mask layout design oneor more times to enhance the mask layout design comprises one or more ofadjusting placement of features of the mask layout design relative toother features in a mask layout design, adding one or more dummyfeatures to the mask layout design, and/or other operations. In someembodiments, adjusting 1106 the mask layout design based on theestimated local electric field(s) and/or other information comprisesoptimizing the mask layout design, for example.

In some embodiments, estimating 1104 the local electric field(s) and/oradjusting 1106 the mask layout design based on the estimated localelectric field(s) and/or other information comprises determining aneffect of the estimated local electric field(s) and the mask layoutdesign for an etch of the patterning process, and adjusting the masklayout design based on the estimated effect of the mask layout design incombination with the local electric field(s) during the etch. In someembodiments, determining the effect of the estimated local electricfield(s) on the mask layout design comprises determining an image chargeon conducting components of the mask layout design, solving Poisson'sEquation to determine the strength and/or orientation of the localelectric field(s) caused by such features, and/or other operations. Insome embodiments, method 1100 comprises iteratively repeating theestimating of the local electric field(s) and the adjusting of the masklayout design one or more times to enhance the mask layout design.

In some embodiments, one or more of operations 1102-1106 of method 1100may comprise outputting an indication of the characteristics of the maskstack region of interest, the mask layout design, the estimated localelectric field(s), and/or other information for review by a user. Insome embodiments, these operations may include receiving entries and/orselections from the user (e.g., via one or more computer systemcomponents described below) that indicate adjustments to the mask stackregion of interest, the mask layout design, the estimated local electricfield(s), and/or other information desired by the user. Method 1100 mayinclude repeating one or more of operations 1102-1106 to adjust the masklayout design based on updated estimated local electric field(s)generated from the inputs and/or selections made by the user.

As shown in FIG. 11 , the adjusting of the mask layout design one ormore times to enhance the mask layout design comprises iteratively(e.g., following “no” 1107—conveying a conclusion that a mask layoutdesign is not optimized) determining 1108 an edge placement (e.g., basedon overlay and imaging constraints and/or other information),determining 1102 and 1104 the effect of the estimated local electricfield(s) and the mask layout design during the etch of the patterningprocess based on the edge placement, and adjusting 1106 the mask layoutdesign based on the effect estimated based on the edge placement.Responsive to completion of the adjustments to the mask layout design(e.g., following “yes” 1107—conveying a conclusion that a mask layoutdesign is optimized), method 1100 outputs 1110 a local electric fieldaware mask layout design.

In some embodiments, methods 1050 (FIG. 10 ) and 1100 (FIG. 11 ) furthercomprise adjusting a target feature (e.g., a metrology target design, amask layout design, and/or other target features) based estimated localelectric field(s) to facilitate three-dimensional metrology. Forexample, a given metrology target may be purposely designed so that itis sensitive to a local electric field. This sensitivity to a localelectric field may allow the given metrology target to function as, oras part of, a metrology tool configured to probe a non-planar third(e.g., “z”) wafer direction. For example, the effect of a local electricfield on an etch can be used as a “probe” to measure the etch depth. Thedeeper the etch, the more asymmetry is introduced in structure that isbeing etched. This can be picked up by a color-to-color dependency of ametrology detection system like Yieldstar, for example.

The embodiments may further be described using the following clauses:

1. A method for adjusting a target feature in a model of a patterningprocess based on local electric fields estimated for the patterningprocess, the method comprising:

obtaining, with a hardware computer system, a mask stack region ofinterest, the mask stack region of interest having one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest, the mask stack region ofinterest including the target feature;

estimating, with the hardware computer system, a local electric fieldbased on the one or more characteristics associated with the propagationof electromagnetic waves through the mask stack region of interest, thelocal electric field estimated for a portion of the mask stack region ofinterest in proximity to the target feature; and

adjusting, by the hardware computer system, the target feature based onthe estimated local electric field.

2. The method of clause 1, wherein adjusting the target feature based onthe estimated local electric field comprises determining, by thehardware computer system, an effect of the estimated local electricfield on the target feature during an etch of the patterning process,and adjusting, by the hardware computer system, the target feature basedon the estimated effect on the target feature during the etch.3. The method of clause 2, wherein determining the effect of theestimated local electric field on the target feature comprisesdetermining, by the hardware computer system, an image charge onconducting components in the portion of the mask stack region ofinterest in proximity to the target feature and/or solving, by thehardware computer system, Poisson's Equation to determine the localelectric field.4. The method of any of clauses 1-3, wherein the target feature is ametrology target design.5. The method of clause 4, further comprising iteratively repeating, bythe hardware computer system, the estimating of the local electric fieldand the adjusting of the target feature one or more times to enhance themetrology target design.6. The method of clause 5, further comprising enhancing, with thehardware computer system, the metrology target design to reduce anestimated difference between an overlay measured after photo resistdevelopment (after development inspection—ADI) and an overlay measuredafter an etch (after etch inspection—AEI) of the patterning process.7. The method of clause 6, wherein the difference between ADI and AEI isan overlay penalty (ADI−AEI).8. The method of clause 7, further comprising determining, with thehardware computer system, a correction for an AEI overlay measurement,and/or determining the AEI overlay measurement, based on the enhancedmetrology target design.9. The method of any of clauses 5-8, wherein the adjusting of the targetfeature one or more times to enhance the metrology target designcomprises one or more of adjusting, by the hardware computer system,placement of the metrology target relative to other features in a masklayout design, or adding, by the hardware computer system, one or moredummy features to the metrology target design.10. The method of any of clauses 1-9, wherein the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise stack characteristicsincluding one or more of layer properties, stack design rules, or layerintegration requirements.11. The method of any of clauses 1-10, wherein the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise metrology targetdesign characteristics including one or more of a top grating design,contrast, or a bottom grating design.12. The method of any of clauses 1-3, wherein the target feature is amask layout design.13. The method of clause 12, further comprising iteratively repeating,by the hardware computer system, the estimating of the local electricfield and the adjusting of the target feature one or more times toenhance the mask layout design.14. The method of clause 13, wherein the adjusting of the target featureone or more times to enhance the mask layout design comprises one ormore of adjusting, by the hardware computer system, feature placement inthe mask layout design, or adding, by the hardware computer system, oneor more dummy features to the mask layout design.15. The method of clause 14, wherein the adjusting of the target featureone or more times to enhance the mask layout design comprises (1)determining, by the hardware computer system, an edge placement, (2)determining, by the hardware computer system, the effect of theestimated local electric field on the mask layout design during the etchof the patterning process based on the edge placement, and (3)adjusting, by the hardware computer system, the mask layout design basedon the effect estimated based on the edge placement.16. The method of any of clauses 12-15, wherein the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise stack characteristicsincluding one or more of layer properties, stack design rules, or layerintegration requirements.17. The method of any of clauses 12-16, wherein the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise mask layout designcharacteristics including an arrangement of features relative to eachother, proximity of conducting portions of individual layers to eachother, or a location of the mask stack region of interest relative to anedge and/or a center of a wafer in the model of the patterning process.18. The method of any of clauses 1-17, further comprising outputting, bythe hardware computer system, and indication of the estimated localelectric field and/or the effect of the estimated local electric fieldon the target feature for review by a user, receiving entries and/orselections, by the hardware computer system, from the user that indicateadjustments to the target feature desired by the user; and adjusting, bythe hardware computer system, the target feature based on the estimatedlocal electric field and the desired adjustments.19. The method of any of clauses 1-18, further comprising adjusting, bythe hardware computer system, the target feature based on the estimatedlocal electric field to facilitate three-dimensional metrology.20. A computer program product comprising a non-transitory computerreadable medium having instructions recorded thereon, the instructionswhen executed by a computer implementing the method of any of clauses1-19.21. The method of any clauses 1-20, wherein the propagation of theelectromagnetic waves corresponds to illumination used in metrologymeasurement.22. The method of any clauses 1-21, wherein the target feature is ametrology target feature.23. The method of any clauses 1-22, wherein the target feature is anoverlay target feature, or an alignment target feature.

FIG. 12 is a block diagram that illustrates a computer system 100 thatcan assist in implementing the methods, flows or the system(s) disclosedherein. Computer system 100 includes a bus 102 or other communicationmechanism for communicating information, and a processor 104 (ormultiple processors 104 and 105) coupled with bus 102 for processinginformation. Computer system 100 also includes a main memory 106, suchas a random access memory (RAM) or other dynamic storage device, coupledto bus 102 for storing information and instructions to be executed byprocessor 104. Main memory 106 also may be used for storing temporaryvariables or other intermediate information during execution ofinstructions to be executed by processor 104. Computer system 100further includes a read only memory (ROM) 108 or other static storagedevice coupled to bus 102 for storing static information andinstructions for processor 104. A storage device 110, such as a magneticdisk or optical disk, is provided and coupled to bus 102 for storinginformation and instructions.

Computer system 100 may be coupled via bus 102 to a display 112, such asa cathode ray tube (CRT) or flat panel or touch panel display fordisplaying information to a computer user. An input device 114,including alphanumeric and other keys, is coupled to bus 102 forcommunicating information and command selections to processor 104.Another type of user input device is cursor control 116, such as amouse, a trackball, or cursor direction keys for communicating directioninformation and command selections to processor 104 and for controllingcursor movement on display 112. This input device typically has twodegrees of freedom in two axes, a first axis (e.g., x) and a second axis(e.g., y), that allows the device to specify positions in a plane. Atouch panel (screen) display may also be used as an input device.

According to one embodiment, portions of one or more methods describedherein may be performed by computer system 100 in response to processor104 executing one or more sequences of one or more instructionscontained in main memory 106. Such instructions may be read into mainmemory 106 from another computer-readable medium, such as storage device110. Execution of the sequences of instructions contained in main memory106 causes processor 104 to perform the process steps described herein.One or more processors in a multi-processing arrangement may also beemployed to execute the sequences of instructions contained in mainmemory 106. In an alternative embodiment, hard-wired circuitry may beused in place of or in combination with software instructions. Thus, thedescription herein is not limited to any specific combination ofhardware circuitry and software.

The term “computer-readable medium” as used herein refers to any mediumthat participates in providing instructions to processor 104 forexecution. Such a medium may take many forms, including but not limitedto, non-volatile media, volatile media, and transmission media.Non-volatile media include, for example, optical or magnetic disks, suchas storage device 110. Volatile media include dynamic memory, such asmain memory 106. Transmission media include coaxial cables, copper wireand fiber optics, including the wires that comprise bus 102.Transmission media can also take the form of acoustic or light waves,such as those generated during radio frequency (RF) and infrared (IR)data communications. Common forms of computer-readable media include,for example, a floppy disk, a flexible disk, hard disk, magnetic tape,any other magnetic medium, a CD-ROM, DVD, any other optical medium,punch cards, paper tape, any other physical medium with patterns ofholes, a RAM, a PROM, and EPROM, a FLASH-EPROM, any other memory chip orcartridge, a carrier wave as described hereinafter, or any other mediumfrom which a computer can read.

Various forms of computer readable media may be involved in carrying oneor more sequences of one or more instructions to processor 104 forexecution. For example, the instructions may initially be borne on amagnetic disk of a remote computer. The remote computer can load theinstructions into its dynamic memory and send the instructions over atelephone line using a modem. A modem local to computer system 100 canreceive the data on the telephone line and use an infrared transmitterto convert the data to an infrared signal. An infrared detector coupledto bus 102 can receive the data carried in the infrared signal and placethe data on bus 102. Bus 102 carries the data to main memory 106, fromwhich processor 104 retrieves and executes the instructions. Theinstructions received by main memory 106 may optionally be stored onstorage device 110 either before or after execution by processor 104.

Computer system 100 may also include a communication interface 118coupled to bus 102. Communication interface 118 provides a two-way datacommunication coupling to a network link 120 that is connected to alocal network 122. For example, communication interface 118 may be anintegrated services digital network (ISDN) card or a modem to provide adata communication connection to a corresponding type of telephone line.As another example, communication interface 118 may be a local areanetwork (LAN) card to provide a data communication connection to acompatible LAN. Wireless links may also be implemented. In any suchimplementation, communication interface 118 sends and receiveselectrical, electromagnetic or optical signals that carry digital datastreams representing various types of information.

Network link 120 typically provides data communication through one ormore networks to other data devices. For example, network link 120 mayprovide a connection through local network 122 to a host computer 124 orto data equipment operated by an Internet Service Provider (ISP) 126.ISP 126 in turn provides data communication services through theworldwide packet data communication network, now commonly referred to asthe “Internet” 128. Local network 122 and Internet 128 both useelectrical, electromagnetic or optical signals that carry digital datastreams. The signals through the various networks and the signals onnetwork link 120 and through communication interface 118, which carrythe digital data to and from computer system 100, are exemplary forms ofcarrier waves transporting the information.

Computer system 100 can send messages and receive data, includingprogram code, through the network(s), network link 120, andcommunication interface 118. In the Internet example, a server 130 mighttransmit a requested code for an application program through Internet128, ISP 126, local network 122 and communication interface 118. Onesuch downloaded application may provide all or part of a methoddescribed herein, for example. The received code may be executed byprocessor 104 as it is received, and/or stored in storage device 110, orother non-volatile storage for later execution. In this manner, computersystem 100 may obtain application code in the form of a carrier wave.

FIG. 13 schematically depicts an exemplary lithographic projectionapparatus in conjunction with the techniques described herein can beutilized. The apparatus comprises:

-   -   an illumination system IL, to condition a beam B of radiation.        In this particular case, the illumination system also comprises        a radiation source SO;    -   a first object table (e.g., patterning device table) MT provided        with a patterning device holder to hold a patterning device MA        (e.g., a reticle), and connected to a first positioner to        accurately position the patterning device with respect to item        PS;    -   a second object table (substrate table) WT provided with a        substrate holder to hold a substrate W (e.g., a resist-coated        silicon wafer), and connected to a second positioner to        accurately position the substrate with respect to item PS;    -   a projection system (“lens”) PS (e.g., a refractive, catoptric        or catadioptric optical system) to image an irradiated portion        of the patterning device MA onto a target portion C (e.g.,        comprising one or more dies) of the substrate W.

As depicted herein, the apparatus is of a transmissive type (i.e., has atransmissive patterning device). However, in general, it may also be ofa reflective type, for example (with a reflective patterning device).The apparatus may employ a different kind of patterning device toclassic mask; examples include a programmable mirror array or LCDmatrix.

The source SO (e.g., a mercury lamp or excimer laser, LPP (laserproduced plasma) EUV source) produces a beam of radiation. This beam isfed into an illumination system (illuminator) IL, either directly orafter having traversed conditioning means, such as a beam expander Ex,for example. The illuminator IL may comprise adjusting means AD forsetting the outer and/or inner radial extent (commonly referred to asσ-outer and σ-inner, respectively) of the intensity distribution in thebeam. In addition, it will generally comprise various other components,such as an integrator IN and a condenser CO. In this way, the beam Bimpinging on the patterning device MA has a desired uniformity andintensity distribution in its cross-section.

It should be noted with regard to FIG. 13 that the source SO may bewithin the housing of the lithographic projection apparatus (as is oftenthe case when the source SO is a mercury lamp, for example), but that itmay also be remote from the lithographic projection apparatus, theradiation beam that it produces being led into the apparatus (e.g., withthe aid of suitable directing mirrors); this latter scenario is oftenthe case when the source SO is an excimer laser (e.g., based on KrF, ArFor F2 lasing).

The beam PB subsequently intercepts the patterning device MA, which isheld on a patterning device table MT. Having traversed the patterningdevice MA, the beam B passes through the lens PL, which focuses the beamB onto a target portion C of the substrate W. With the aid of the secondpositioning means (and interferometric measuring means IF), thesubstrate table WT can be moved accurately, e.g. so as to positiondifferent target portions C in the path of the beam PB. Similarly, thefirst positioning means can be used to accurately position thepatterning device MA with respect to the path of the beam B, e.g., aftermechanical retrieval of the patterning device MA from a patterningdevice library, or during a scan. In general, movement of the objecttables MT, WT will be realized with the aid of a long-stroke module(coarse positioning) and a short-stroke module (fine positioning), whichare not explicitly depicted. However, in the case of a stepper (asopposed to a step-and-scan tool) the patterning device table MT may justbe connected to a short stroke actuator, or may be fixed.

The depicted tool can be used in two different modes:

-   -   In step mode, the patterning device table MT is kept essentially        stationary, and an entire patterning device image is projected        in one go (i.e., a single “flash”) onto a target portion C. The        substrate table WT is then shifted in the x and/or y directions        so that a different target portion C can be irradiated by the        beam PB;    -   In scan mode, essentially the same scenario applies, except that        a given target portion C is not exposed in a single “flash”.        Instead, the patterning device table MT is movable in a given        direction (the so-called “scan direction”, e.g., the y        direction) with a speed v, so that the projection beam B is        caused to scan over a patterning device image; concurrently, the        substrate table WT is simultaneously moved in the same or        opposite direction at a speed V=Mv, in which M is the        magnification of the lens PL (typically, M=¼ or ⅕). In this        manner, a relatively large target portion C can be exposed,        without having to compromise on resolution.

FIG. 14 shows the apparatus 1000 in more detail, including the sourcecollector module SO, the illumination system IL, and the projectionsystem PS. The source collector module SO is constructed and arrangedsuch that a vacuum environment can be maintained in an enclosingstructure 220 of the source collector module SO. An EUV radiationemitting plasma 210 may be formed by a discharge produced plasma source.EUV radiation may be produced by a gas or vapor, for example Xe gas, Livapor or Sn vapor in which the very hot plasma 210 is created to emitradiation in the EUV range of the electromagnetic spectrum. The very hotplasma 210 is created by, for example, an electrical discharge causingat least partially ionized plasma. Partial pressures of, for example, 10Pa of Xe, Li, Sn vapor or any other suitable gas or vapor may berequired for efficient generation of the radiation. In an embodiment, aplasma of excited tin (Sn) is provided to produce EUV radiation.

The radiation emitted by the hot plasma 210 is passed from a sourcechamber 211 into a collector chamber 212 via an optional gas barrier orcontaminant trap 230 (in some cases also referred to as contaminantbarrier or foil trap) which is positioned in or behind an opening insource chamber 211. The contaminant trap 230 may include a channelstructure. Contamination trap 230 may also include a gas barrier or acombination of a gas barrier and a channel structure. The contaminanttrap or contaminant barrier 230 further indicated herein at leastincludes a channel structure, as known in the art.

The collector chamber 211 may include a radiation collector CO which maybe a so-called grazing incidence collector. Radiation collector CO hasan upstream radiation collector side 251 and a downstream radiationcollector side 252. Radiation that traverses collector CO can bereflected off a grating spectral filter 240 to be focused in a virtualsource point IF along the optical axis indicated by the dot-dashed line‘O’. The virtual source point IF is commonly referred to as theintermediate focus, and the source collector module is arranged suchthat the intermediate focus IF is located at or near an opening 221 inthe enclosing structure 220. The virtual source point IF is an image ofthe radiation emitting plasma 210.

Subsequently the radiation traverses the illumination system IL, whichmay include a facetted field mirror device 22 and a facetted pupilmirror device 24 arranged to provide a desired angular distribution ofthe radiation beam 21, at the patterning device MA, as well as a desireduniformity of radiation intensity at the patterning device MA. Uponreflection of the beam of radiation 21 at the patterning device MA, heldby the support structure MT, a patterned beam 26 is formed and thepatterned beam 26 is imaged by the projection system PS via reflectiveelements 28, 30 onto a substrate W held by the substrate table WT.

More elements than shown may generally be present in illumination opticsunit IL and projection system PS. The grating spectral filter 240 mayoptionally be present, depending upon the type of lithographicapparatus. Further, there may be more mirrors present than those shownin the figures, for example there may be 1-6 additional reflectiveelements present in the projection system PS than shown in FIG. 20 .

Collector optic CO, as illustrated in FIG. 14 , is depicted as a nestedcollector with grazing incidence reflectors 253, 254 and 255, just as anexample of a collector (or collector mirror). The grazing incidencereflectors 253, 254 and 255 are disposed axially symmetric around theoptical axis O and a collector optic CO of this type may be used incombination with a discharge produced plasma source, often called a DPPsource.

Alternatively, the source collector module SO may be part of an LPPradiation system as shown in FIG. 15 . A laser LA is arranged to depositlaser energy into a fuel, such as xenon (Xe), tin (Sn) or lithium (Li),creating the highly ionized plasma 210 with electron temperatures ofseveral 10's of eV. The energetic radiation generated duringde-excitation and recombination of these ions is emitted from theplasma, collected by a near normal incidence collector optic CO andfocused onto the opening 221 in the enclosing structure 220.

The concepts disclosed herein may simulate or mathematically model anygeneric imaging system for imaging sub wavelength features, and may beespecially useful with emerging imaging technologies capable ofproducing increasingly shorter wavelengths. Emerging technologiesalready in use include EUV (extreme ultra violet), DUV lithography thatis capable of producing a 193 nm wavelength with the use of an ArFlaser, and even a 157 nm wavelength with the use of a Fluorine laser.Moreover, EUV lithography is capable of producing wavelengths within arange of 20-5 nm by using a synchrotron or by hitting a material (eithersolid or a plasma) with high energy electrons in order to producephotons within this range.

While the concepts disclosed herein may be used for imaging on asubstrate such as a silicon wafer, it shall be understood that thedisclosed concepts may be used with any type of lithographic imagingsystems, e.g., those used for imaging on substrates other than siliconwafers.

The descriptions above are intended to be illustrative, not limiting.Thus, it will be apparent to one skilled in the art that modificationsmay be made as described without departing from the scope of the claimsset out below.

What is claimed is:
 1. A method for determining a target feature in amodel of a patterning process based on local electric fields estimatedfor the patterning process, the method comprising: obtaining, with ahardware computer system, a mask stack region of interest, the maskstack region of interest having one or more characteristics associatedwith propagation of electromagnetic waves through the mask stack regionof interest, the mask stack region of interest including the targetfeature; estimating, with the hardware computer system, a local electricfield based on the one or more characteristics associated with thepropagation of electromagnetic waves through the mask stack region ofinterest during metrology measurement, the local electric fieldestimated for a portion of the mask stack region of interest inproximity to the target feature; and adjusting, by the hardware computersystem, the target feature based on the estimated local electric field.2. The method of claim 1, wherein adjusting the target feature based onthe estimated local electric field comprises determining, by thehardware computer system, an effect of the estimated local electricfield on the target feature during an etch of the patterning process,and adjusting, by the hardware computer system, the target feature basedon the estimated effect on the target feature during the etch.
 3. Themethod of claim 2, wherein determining the effect of the estimated localelectric field on the target feature comprises determining, by thehardware computer system, an image charge on conducting components inthe portion of the mask stack region of interest in proximity to thetarget feature and/or solving, by the hardware computer system,Poisson's Equation to determine the local electric field.
 4. The methodof claim 1, wherein the target feature is a metrology target design. 5.The method of claim 4, further comprising iteratively repeating, by thehardware computer system, the estimating of the local electric field andthe adjusting of the target feature one or more times to enhance themetrology target design, and/or enhancing, with the hardware computersystem, the metrology target design to reduce an estimated differencebetween an overlay measured after photo resist development (afterdevelopment inspection—ADI) and an overlay measured after an etch (afteretch inspection—AEI) of the patterning process, and/or wherein thedifference between ADI and AEI is an overlay penalty (ADI−AEI).
 6. Themethod of claim 5, further comprising determining, with the hardwarecomputer system, a correction for an AEI overlay measurement, and/ordetermining the AEI overlay measurement, based on the enhanced metrologytarget design.
 7. The method of claim 5, wherein the adjusting of thetarget feature one or more times to enhance the metrology target designcomprises one or more of adjusting, by the hardware computer system,placement of the metrology target relative to other features in a masklayout design, or adding, by the hardware computer system, one or moredummy features to the metrology target design.
 8. The method of claim 1,wherein the one or more characteristics associated with propagation ofelectromagnetic waves through the mask stack region of interest comprisestack characteristics including one or more of layer properties, stackdesign rules, or layer integration requirements.
 9. The method of claim1, wherein the one or more characteristics associated with propagationof electromagnetic waves through the mask stack region of interestcomprise metrology target design characteristics including one or moreof a top grating design, contrast, or a bottom grating design.
 10. Themethod of claim 1, wherein the target feature is a mask layout design.11. The method of claim 10, further comprising iteratively repeating, bythe hardware computer system, the estimating of the local electric fieldand the adjusting of the target feature one or more times to enhance themask layout design, and/or wherein the adjusting of the target featureone or more times to enhance the mask layout design comprises one ormore of adjusting, by the hardware computer system, feature placement inthe mask layout design, or adding, by the hardware computer system, oneor more dummy features to the mask layout design, and/or wherein theadjusting of the target feature one or more times to enhance the masklayout design comprises (1) determining, by the hardware computersystem, an edge placement, (2) determining, by the hardware computersystem, the effect of the estimated local electric field on the masklayout design during the etch of the patterning process based on theedge placement, and (3) adjusting, by the hardware computer system, themask layout design based on the effect estimated based on the edgeplacement.
 12. The method of claim 10, wherein the one or morecharacteristics associated with propagation of electromagnetic wavesthrough the mask stack region of interest comprise stack characteristicsincluding one or more of layer properties, stack design rules, or layerintegration requirements.
 13. The method of claim 10, wherein the one ormore characteristics associated with propagation of electromagneticwaves through the mask stack region of interest comprise mask layoutdesign characteristics including an arrangement of features relative toeach other, proximity of conducting portions of individual layers toeach other, or a location of the mask stack region of interest relativeto an edge and/or a center of a wafer in the model of the patterningprocess.
 14. The method of claim 1, further comprising outputting, bythe hardware computer system, and indication of the estimated localelectric field and/or the effect of the estimated local electric fieldon the target feature for review by a user, receiving entries and/orselections, by the hardware computer system, from the user that indicateadjustments to the target feature desired by the user; and adjusting, bythe hardware computer system, the target feature based on the estimatedlocal electric field and the desired adjustments.
 15. The method ofclaim 1, further comprising adjusting, by the hardware computer system,the target feature based on the estimated local electric field tofacilitate three-dimensional metrology.
 16. A computer program productcomprising a non-transitory computer readable medium having instructionsrecorded thereon, the instructions when executed by a computerimplementing the method of claim 1.